TMT World Congress 2025 will provide a forum for senior dealmakers to network and discuss investment and M&A opportunities in digital infrastructure, telecoms and tech across EMEA and beyond.
During the conference, Kemal Hawa will moderate panel, "Financing Digital Infrastructure Leaders: Identifying Opportunities for Growth and Investment" on Thursday, Jan. 30 from 1:40 p.m.-2:20 p.m. GMT. In the current macroeconomic environment, deal structures and the financing ecosystem are rapidly evolving, prompting new strategies and approaches. Across digital infrastructure, certain areas are seeing heightened activity, signaling where opportunities may lie, whilst private credit continues to play a significant role in the market, leading to shifts in how traditional lenders are responding to the changing landscape. New forms of financing are also emerging, including asset-backed securities (ABS), ESG-linked notes, and other innovative structures, reflecting a broader transformation in how deals are structured and financed. This panel will explore these trends and provide insights into the future of deal-making.
During the conference, Kemal Hawa will moderate panel, "Financing Digital Infrastructure Leaders: Identifying Opportunities for Growth and Investment" on Thursday, Jan. 30 from 1:40 p.m.-2:20 p.m. GMT. In the current macroeconomic environment, deal structures and the financing ecosystem are rapidly evolving, prompting new strategies and approaches. Across digital infrastructure, certain areas are seeing heightened activity, signaling where opportunities may lie, whilst private credit continues to play a significant role in the market, leading to shifts in how traditional lenders are responding to the changing landscape. New forms of financing are also emerging, including asset-backed securities (ABS), ESG-linked notes, and other innovative structures, reflecting a broader transformation in how deals are structured and financed. This panel will explore these trends and provide insights into the future of deal-making.